1合金熔点温度
Composition |
锡
（Sn） |
银
（Ag） |
铜
（Cu） |
熔点（℃） |
|
合金 |
固相 |
液相 |
|
SAC305 |
Balance |
3.0 |
0.5 |
— |
217 |
219 |
|
SAC387 |
Balance |
3.8 |
0.7 |
— |
217 |
219 |
|
SAC405 |
Balance |
4.0 |
0.5 |
— |
217 |
219 |
2合金成分
 1 Alloy
 2 Inspect to(%wt)
3Element |
Sn96.5Ag3.0Cu0.5
(SAC305) |
Sn95.5Ag3.8Cu0.7
(SAC387) |
Sn95.5Ag4.0Cu0.5
(SAC405) |
|
Sn |
Balance |
Balance |
Balance |
|
Pb |
0.05Max |
0.05Max |
0.05Max |
|
Sb |
0.05Max |
0.05Max |
0.05Max |
|
Ag |
2.8—3.2 |
3.6—4.0 |
3.8—4.0 |
|
Ni |
0.001—0.1 |
0.001—0.1 |
0.001—0.1 |
|
Al |
0.001 Max |
0.001 Max |
0.001 Max |
|
As |
0.03 Max |
0.03 Max |
0.03 Max |
|
Bi |
0.03 Max |
0.03 Max |
0.03 Max |
|
Cd |
0.002 Max |
0.002 Max |
0.002 Max |
|
Ge |
0.001—0.1 |
0.001—0.1 |
0.001—0.1 |
|
Cu |
0.3—0.7 |
0.5—0.9 |
0.3—0.7 |
|
Fe |
0.02 Max |
0.02 Max |
0.02 Max |
|
Zn |
0.001 Max |
0.001 Max |
0.001 Max |
3产品规格表（Sn96.5Ag3.0Cu0.5）
直径（mm） |
公差（mm） |
真圆度（mm） |
每瓶数量（粒） |
每瓶净重（g） |
|
0.889 |
±0.020 |
＜0.020 |
125000 |
336.68 |
|
0.760 |
±0.020 |
＜0.020 |
250000 |
426.24 |
|
0.650 |
±0.020 |
＜0.019 |
250000 |
266.65 |
|
0.600 |
±0.020 |
＜0.018 |
250000 |
209.46 |
|
0.550 |
±0.020 |
＜0.017 |
250000 |
161.55 |
|
0.500 |
±0.015 |
＜0.015 |
250000 |
121.23 |
|
0.450 |
±0.015 |
＜0.014 |
250000 |
88.36 |
|
0.400 |
±0.015 |
＜0.013 |
500000 |
124.06 |
|
0.350 |
±0.010 |
＜0.011 |
500000 |
83.11 |
|
0.300 |
±0.010 |
＜0.010 |
500000 |
52.34 |
|
0.250 |
±0.008 |
＜0.009 |
1000000 |
60.58 |
|
0.200 |
±0.008 |
＜0.009 |
1000000 |
31.07 |
4标准包装方式：以下是静电瓶包装锡球的容量
球径 |
数量/瓶 |
瓶/内箱 |
内箱/货箱 |
数量/货箱 |
|
0.889mm |
125kpcs |
6 |
10 |
7.5kkpcs |
|
0.760mm |
250kpcs |
6 |
10 |
15kkpcs |
|
0.600mm |
250kpcs |
6 |
10 |
15kkpcs |
|
0.500mm |
250kpcs |
6 |
10 |
15kkpcs |
|
0.450mm |
250kpcs |
6 |
10 |
15kkpcs |
|
0.400mm |
500kpcs |
6 |
10 |
30kkpcs |
|
0.350mm |
500kpcs |
6 |
10 |
30kkpcs |
|
0.300mm |
500kpcs |
6 |
10 |
30kkpcs |
|
0.250mm |
500kpcs |
6 |
10 |
30kkpcs |
|
0.200mm |
1000kpcs |
6 |
10 |
100kkpcs |
|
0.150mm |
250kpcs |
6 |
10 |
100kkpcs |
|
0.100mm |
250kpcs |
6 |
10 |
100kkpcs |
5回焊加热曲线
以下回焊加热曲线仅供参考,实际生产制程所使用的回焊加热曲线需经过测试,以便达到理想标准的实际要求:
|
Profile Feature
回焊加热曲线 |
Pb-Free Assemble
无铅制程 |
|
Average Ramp Up Rate / 升温速度 |
3℃/second max |
|
Preheat Temperature / 预热温度 |
150℃~200℃ |
|
Preheat time / 预热时间 |
60~180 Seconds |
|
Peak Temperature / 顶温 |
245℃~260℃ |
|
Time within 5℃ of actual Peak temperature |
20~40 Seconds |
|
Ramp Down Rate / 降温速度 |
6℃/second max |
|
Time 25℃ to Peak Temperature |
8 minues max |
6无铅锡球标签样板：
7 安全注意事项与操作请参考≤BGA无铅锡球物质安全资料表≥
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